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Model:Micro Etch 80
Features
- Supports large-format etching on complex, non-developable 3D curved surfaces ;
- Integrated 3D model analysis and programming functions, enabling precise segmentation and path optimization for large-area curved surface graphics ;
- Real-time 3D model processing visualization, allowing users to monitor the machining process ;
- Advanced vision-based alignment and high-precision automatic distance focusing for accurate processing ;
- Hardware status monitoring system for detecting anomalies, featuring an intuitive human-machine interface for simple and user-friendly operation ;
- One-click processing data generation, eliminating the need for manual programming and enabling fully automated machining ;
- Built-in safety interlock system, preventing laser operation if the safety door is opened, ensuring operator safety ;
- Equipped with air-blowing and dust purification functions for a clean processing environment.
★ Machine travel and laser configuration can be customized
Specifications
| Positioning Accuracy (X/Y/Z) (mm) | 0.015 |
| Repeatability Accuracy (X/Y/Z) (mm) | 0.010 |
| A/C Axis Travel ( ° ) | ±110/0-360 |
| A/C Axis Positioning Accuracy ( ”) | 15 |
| A/C Axis Repeatability Accuracy ( ”) | 10 |
| Pulse Width (fs) | <290 |
| Average Power（w） | 20 |
| Maximum Workpiece Rotation Diameter（mm） | Φ200 |
| Worktable Load Capacity（kg） | 20 |
| Maximum Curved Surface Workpiece Size (mm) | Φ200X200 |
| Free Travel Range (X/Y/Z) (mm) | 800/500/450 |
| Maximum Planar Workpiece Size（mm ） | 700X400(Requires Dedicated Fixture)
|
| Scanning Width Marking Accuracy（mm） | ±0.02 |
| Weight（t） | ~8 |
| Dimensions (mm) (W × D ×H) | 4750X4200X2600 |
